Milan, April 12 2019 – First silicon available from X-FAB in the framework of RAD-PROM project funded by the Italian Space Agency (ASI). Test chips contain RedCat Devices proprietary AntiFuse memory cells with both Dog-Bone and Edge-less shapes designed in a standard 180nm CMOS process (xh018). Visual inspection done at RCD laboratories shown that all chips are ready to be bonded in standard ceramic packages suitable to used in the irradiation facilities for Cobalt 60 (TID) and heavy ions (SEE).